What are the main aspects of the package level of the connector application?
From the point of view of electronic connector technology, the level of connection is the penalty from the connection system, not the connector itself.Understanding some of the technical level aspects can help us better understand connector applications.Konnra Electronic engineers take a sneak peek at the six levels of electronic encapsulation that must be involved in connector applications.
According to Konnra Electroncis engineers, there are six main aspects of the package level for connector applications, as follows:
Level 1: The connection between the chip's internal integrated circuit and the metal pins is mainly manufactured by a high-speed automatic method. This method is somewhat special, usually not separable and repairable, and must be extremely reliable, such as the level of various chip connections, incorporated into the package of the device.
Level 2: The connection between the chip and the PCB must usually be resistant to soldering. Relatively speaking, the smaller size usually does not require the fixed number of insertions of the fixed hardware, and needs to be serviced by professionals.
Level 3: There are usually three types of connections between PCBs, mother/daughter, Parallel Stacked, and Planar. The number of insertions is from tens to hundreds of times, the number of needles is relatively large, and more than 1000 is a level of high-density connector connection. Due to the high number of pins, the insertion force is more important, with guiding hardware and keys.
Level 4: Connections between subsystems. Because subsystems can always have a certain distance, they usually complete special structures through Cable and Harness, which is convenient for cable applications. The number of insertions is at the level of several hundred connections. Since the user is connected by himself, it is common to make the locking structure rigid and prevent disengagement caused by vibration or movement of other devices.
Level 5: The connection between the internal subsystem of the system and the I/O interface. Since half of the connector is outside the system, standardization is important. The same reason is sturdy and easy to use, and it is important to consider shielding, filtering and interference. Other requirements are the same as level 4, for example: USB series, IEEE 1394 series, MOD JK series, D-Sub series, and the like.
Level 6: Connections between different systems, including cable assemblies, power cord assemblies, RF coaxial cable assemblies, and fiber optics, with retention levels 4 and 5. Sturdy becomes important, the number of insertions is increased, hundreds or even thousands of times, and shielding and filtration are important due to the longer length of exposure.
Level 1: The connection between the chip's internal integrated circuit and the metal pins is mainly manufactured by a high-speed automatic method. This method is somewhat special, usually not separable and repairable, and must be extremely reliable, such as the level of various chip connections, incorporated into the package of the device.
Level 2: The connection between the chip and the PCB must usually be resistant to soldering. Relatively speaking, the smaller size usually does not require the fixed number of insertions of the fixed hardware, and needs to be serviced by professionals.
Level 3: There are usually three types of connections between PCBs, mother/daughter, Parallel Stacked, and Planar. The number of insertions is from tens to hundreds of times, the number of needles is relatively large, and more than 1000 is a level of high-density connector connection. Due to the high number of pins, the insertion force is more important, with guiding hardware and keys.
Level 4: Connections between subsystems. Because subsystems can always have a certain distance, they usually complete special structures through Cable and Harness, which is convenient for cable applications. The number of insertions is at the level of several hundred connections. Since the user is connected by himself, it is common to make the locking structure rigid and prevent disengagement caused by vibration or movement of other devices.
Level 5: The connection between the internal subsystem of the system and the I/O interface. Since half of the connector is outside the system, standardization is important. The same reason is sturdy and easy to use, and it is important to consider shielding, filtering and interference. Other requirements are the same as level 4, for example: USB series, IEEE 1394 series, MOD JK series, D-Sub series, and the like.
Level 6: Connections between different systems, including cable assemblies, power cord assemblies, RF coaxial cable assemblies, and fiber optics, with retention levels 4 and 5. Sturdy becomes important, the number of insertions is increased, hundreds or even thousands of times, and shielding and filtration are important due to the longer length of exposure.
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